The chip delivery period of major IC manufacturers is extending

21/01/2021 Seektronics

List of Leading Semiconductor Manufacturers

ST : 20-26 weeks, including automotive grade (A series) chips;


NXP : The current standard delivery period is 16-20 weeks, with frequent bounces and other situations, and the actual delivery time is 26 weeks;


ALTERA: The overall increase in demand from Altera and the increasingly tight production capacity of the original factory have led to an extension of the schedule and delivery period by about 6-8 weeks on the original basis;


Maxim: In the past, the delivery time was about 8-10 weeks. Recently, due to insufficient wafer supply, the delivery time of many materials has reached about 20 weeks;


Renesas : 20-24 weeks;


TI : TI’s 8-inch wafers are seriously in short supply, and the average delivery time is extended to about 30 weeks, and some even reach 50 weeks;


Toshiba: According to friends in the market, Toshiba's delivery period has been extended to about half a year;


Qualcomm: The delivery time for all series of materials has been extended to more than 30 weeks, and the delivery time of CSR88 series has reached more than 33 weeks;


Broadcom: The original delivery time of 50 weeks has been implemented recently. For this delivery time, basically no customers can accept it;


Diodes: According to the latest market report released by FUTURE, the delivery period of Diodes low-voltage Mosfet has been extended to 17-22 weeks;


Silica: The order cycle for most products is at least 14 weeks;


Murata: Following last month, Murata notified the customer that the delivery period should be at least 98 days, and the notice will be extended by 2 weeks in the near future. It will take at least 112 days, or 180 days if it is slow. The special high-capacity delivery period is the longest;


Taiyo Yuden: The original delivery period of Taiyo Yuden was at least 84 days, and it was further extended from 24 days to 112 days.


Since last year, the semiconductor industry has been "rising" continuously. Price increases involve foundry, design, and packaging and testing. The areas of price increases include memory chips, power management chips, and automotive chips.